Input Power

• Single phase 220 VAC, 50 / 60Hz
• 700 W (including vacuum pump)
• For using 110 VAC, we will include a transformer for you. Please select the voltage in the Product Options

Output Power

• 1600 VDC
• 40 mA max

Vacuum Chamber

• Vacuum chamber: 150 mm ID x 165mm OD x 150 mm H, made of high purity quartz
• Sealing flange made of stainless steel with flat O-ring

Sample Stage with Heater

• Stage size: 50 mm Dia.
• Sputtering distance range: 25 – 40 mm adjustable
• Rotatable stage with three sputtering positions (controlled by the touch screen)
• Substrate heater is built-in with a maximum heating temperature of 500 °C
• PID temperature controller with +/- 1 °C accuracy is integrated into the touch screen

Control Panel

• 6” color touch screen with PLC integration for easy operation
• Vacuum gauge, sputtering current meter, and substrate temperature control are integrated to the touch screen panel
• Adjustment knobs on the front panel for gas intake and sputtering current control
• Sputtering position, sputtering timer, and process logging are accessible from the touch screen

Shield

• Stainless steel shield cage is included for extra protection

Sputtering Targets

• Target size requirements: 47 mm Dia. x 2.5 mm max
• Three targets are included in the standard package for immediate use:
• Au target, 47 mm Dia. x 0.12 mm
• Ag target, 47 mm Dia. x 0.5 mm
• Cu target, 47 mm Dia. x 2.5 mm
• Various targets are available to order at MTI

Vacuum Pump
(Optional)

• Built-in KF25 vacuum port for connecting to a vacuum pump.
• Vacuum pump with KF25 connector is required, but not included. User may choose
• A double stage mechanical vacuum pump for vacuum up to 1.0E-2 Torr.
• Or a turbo pump for vacuum up to 1.0E-5 Torr
• Vacuum pump can be plugged into the power outlet on the left of coater for automatic control
• 

    Dimensions
    

•   440 mm L × 330 mm W × 455 mm H

Net Weight

• 50 kg

Compliance

• CE approval
• MET Certification (UL 1450) is available upon request at extra cost, please contact our sales representative for quote

Warranty

• One year limited with lifetime support

Application Notes

• For the best film-substrate adhesion strength, please clean the substrate surface before coating:
• Ultrasonic cleaning with the following sequential baths - (1) acetone, (2) isopropyl alcohol - to remove oil and grease. Blow dry the substrate with N2, then hot bake in vacuum to remove absorbed moisture
• Plasma cleaning may be needed for surface roughening, surface chemical bonds activation, or additional contamination removal
• A thin buffer layer (~5 nm), such as Cr, Ti, Mo, Ta, could be applied to improve adhesion of metals and alloys

• A two-stage pressure regulator (not included) should be installed on the gas cylinder to limit the output pressure of gas to below 0.02 MPa for safe usage. Please use > 5N purity Ar gas for plasma sputtering
• The sputtering coater can be placed into an Ar and N2 gas glove box for coating
• HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator must shut down the equipment before sample loading and target changing operations
• This model is not suitable for coating light metallic material such as Al, Mg, Zn, Ni, etc. due to low energy. Please consider our magnetron sputtering coater or thermal evaporation coater. Click pictures below for detail